Non-ultraviolet (UV) Dicing Tapes Non-UV Dicing Tapes are thin adhesive tapes utilized during wafer manufacturing to keep bits of semiconductor intact during cutting. These tapes are generally adaptable movies made of PVC. These tapes can be effortlessly eliminated after the finishing of the dicing system. The tapes normally produced using polymers are extremely light, profoundly steady, very adaptable, gives a good boundary and is impervious to high pressure. The dicing tapes are exceptionally delicate to UV rays and their adhesives properties can modify when exposed. They are available in a more extensive range of thickness and expandability.